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Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Frontiers of Mechanical Engineering 2011, Volume 6, Issue 2,   Pages 214-218 doi: 10.1007/s11465-011-0130-5

Abstract:

The process of patterned wafer bonding using ultraviolet (UV) adhesive as the intermediate layer wasof patterned quartz/quartz.Experimental results indicate that patterned wafer bonding using UV adhesive is achieved under room temperaturearea after bonding.Patterned wafer bonding using UV adhesive will have great potential in the fabrication of microfluidic

Keywords： ultraviolet (UV) adhesive     intermediate layer     patterned wafer bonding    

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Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells

Frontiers in Energy 2017, Volume 11, Issue 1,   Pages 1-3 doi: 10.1007/s11708-016-0436-4

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Morphologies of diblock copolymer confined in a slit with patterned surfaces studied by dissipative particle

FENG Jian, HUANG Yongmin, LIU Honglai, HU Ying

Frontiers of Chemical Science and Engineering 2007, Volume 1, Issue 2,   Pages 132-139 doi: 10.1007/s11705-007-0025-5

Abstract: To overcome this disadvantage, the diblock copolymer confined in a restricted system with a patternedIn this work, the morphologies of a thin film of diblock copolymer confined between patterned and neutral

Keywords： weight     nano-fabrication     morphology     matching     dissipative particle    

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The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 2,   Pages 238-241 doi: 10.1007/s11465-006-0011-5

Abstract: Electrostatic-alloy bonding of silicon wafer with glass deposited by Au to form Si/Au-glass water, andbonding of Si/Au-glass with silicon wafer were researched during fabrication of pressure sensors.The silicon wafer and glass wafer with an Au film resistor were bonded by electrostatic bonding, andthen Si-Au alloy bonding was formed by annealing at 400vH for 2 h.The results indicate that large bond strength was obtained at the bonding interface.

Keywords： Si/Au-glass     strength     MEMS packaging     process     sandwich structure    

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Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Frontiers of Mechanical Engineering 2010, Volume 5, Issue 1,   Pages 87-92 doi: 10.1007/s11465-009-0078-x

Abstract: the traditional wet chemical activation processes, is applied to enhance hydrophilic silicon direct bondingThe effects of UV exposure on silicon wafers’ nano-topography and bonding strength are studied.The correlations of annealing temperature and annealing time vs. bonding strength are experimentallyResults indicate that the bonding strength increases sharply then gently with increasing annealing temperatureIt follows from the results that the bonding strength of silicon wafer pairs with UV exposure decreases

Keywords： ultraviolet (UV) exposure     silicon direct bonding     bonding strength     reliability    

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A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Frontiers of Mechanical Engineering 2006, Volume 1, Issue 3,   Pages 360-363 doi: 10.1007/s11465-006-0027-x

Abstract: A space solar cell bonding robot system which consists of a three-axis Cartesian coordinate s robot,coating device, bonding device, orientation plate, and control subsystem was studied.

Keywords： Cartesian coordinate     thickness     three-axis Cartesian     orientation     control subsystem    

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Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Strategic Study of CAE 2014, Volume 16, Issue 4,   Pages 40-44

Abstract:

The starch- based aqueous polymer isocycante（API）gluelam bonding as theresearch object，with tensile shear strength as a key evaluation index，accelerated aging tests on gluelam bondingto study damage mode and failure mechanism of the bonding The results show that：the adhesive fractureproperties of ductile fracture structure，and with the increase of aging time，the damage mode of the bonding

Keywords： bonding structure     accelerated aging     fracture character     damage mode    

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Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Frontiers of Chemical Science and Engineering 2017, Volume 11, Issue 3,   Pages 465-482 doi: 10.1007/s11705-017-1641-3

Abstract: For more than six decades, chromic acid anodizing (CAA) has been the central process in the surface pre-treatment of aluminum for adhesively bonded aircraft structures. Unfortunately, this electrolyte contains hexavalent chromium (Cr(VI)), a compound known for its toxicity and carcinogenic properties. To comply with the new strict international regulations, the Cr(VI)-era will soon have to come to an end. Anodizing aluminum in acid electrolytes produces a self-ordered porous oxide layer. Although different acids can be used to create this type of structure, the excellent adhesion and corrosion resistance that is currently achieved by the complete Cr(VI)-based process is not easily matched. This paper provides a critical overview and appraisal of proposed alternatives to CAA, including combinations of multiple anodizing steps, pre- and post anodizing treatments. The work is presented in terms of the modifications to the oxide properties, such as morphological features (e.g., pore size, barrier layer thickness) and surface chemistry, in order to evaluate the link between fundamental principles of adhesion and bond performance.

Keywords： aluminum     Cr(VI)-free     surface pre-treatments     anodizing     adhesive bonding    

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ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Frontiers of Mechanical Engineering 2009, Volume 4, Issue 2,   Pages 134-146 doi: 10.1007/s11465-009-0033-x

Abstract: When welding steel with aluminum, the appearance of intermetallic compounds of Fe and Al will decrease tenacity and increase rigidity, which leads to bad joint performance. A new type of low energy input (LEI) welding technology is introduced which can be used to weld steel with aluminum. Using the technology, brazing was located on the steel side and arc fusion welding on the aluminum side. The less heat input reduces the thickness of intermetallic compounds to 3-4 μm. Tensile strength tests prove that the joint breaks at the heat-affected zone and the strength is higher than 70% of the aluminum’s. Thus, the method can lead to a good performance joint.

Keywords： joining of steel and aluminum     low energy input welding     arc welding     fusion welding – brazing    

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Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Strategic Study of CAE 2002, Volume 4, Issue 6,   Pages 56-62

Abstract: mechanical systems (MEMS) is referred to first-level packaging and limited generally to the preservation of waferIt is based on bulk silicon bonding technology and film sealed technology.The bulk silicon bonding technology includes electrostatic bonding, silicon direct bonding and interfaciallayer assisted bonding.The film sealed technology includes whole-wafer operation, local-wafer operation and selective preservation

Keywords： packaging of MEMS     bulk silicon bonding technology     film-sealed technology    

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Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

Frontiers of Chemical Science and Engineering 2023, Volume 17, Issue 10,   Pages 1568-1580 doi: 10.1007/s11705-023-2303-2

Abstract: By using a two-step hydrothermal method and trithiocyanuric acid (TTCA), 2,4,6-trihydrazino-1,3,5-triazine (THT), and Fe3O4 as raw materials, a spherical magnetic adsorbent polymer (TTCA/THT@Fe3O4) was synthesized to achieve the efficient removal of Cr(VI) from wastewater. Under optimal adsorption conditions, the maximum adsorption capacity of TTCA/THT@Fe3O4 for Cr(VI) can reach 1340 mg∙g‒1. Notably, the removal efficiency can approach 98.9%, even at the lower concentration of 20 mg∙L‒1 Cr(VI). For actual wastewater containing Cr(VI), the Cr(VI) concentration was reduced from 25.8 to 0.4 mg∙L‒1, a remarkable 20% lower than the current industry discharge standard value. A mechanism for the high adsorption performance of Cr(VI) on TTCA/THT@Fe3O4 was investigated using Fourier transform infrared spectroscopy, X-ray photoelectron spectroscopy, and density functional theory. It can be plausibly attributed to the formation of Cr/N and Cr/S coordination bonds. Additionally, surface electrostatic adsorption, reduction effects, and the spherical polymer structure increase the contact area with Cr(VI), maximizing adsorption. The synergistic effect of adsorption and reduction enhances the adsorption performance of TTCA/THT@Fe3O4 for Cr(VI) and total chromium in water. The resultant polymer has a simple preparation process, excellent adsorption performance, easy magnetic separation, and promising application for actual wastewater.

Keywords： magnetic polymer     chromium removal     hydrogen bonding     recyclability     actual wastewater    

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Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

Frontiers of Mechanical Engineering 2021, Volume 16, Issue 3,   Pages 559-569 doi: 10.1007/s11465-020-0624-0

Abstract: Taping is often used to protect patterned wafers and reduce fragmentation during backgrinding of silicon

Keywords： taping     silicon wafer     backgrinding     subsurface damage     surface roughness    

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MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 557-566 doi: 10.1007/s11465-017-0441-2

Abstract:

In the past decade, micro-electromechanical systems (MEMS)-based thermoelectric infrared (IR) sensors have received considerable attention because of the advances in micromachining technology. This paper presents a review of MEMS-based thermoelectric IR sensors. The first part describes the physics of the device and discusses the figures of merit. The second part discusses the sensing materials, thermal isolation microstructures, absorber designs, and packaging methods for these sensors and provides examples. Moreover, the status of sensor implementation technology is examined from a historical perspective by presenting findings from the early years to the most recent findings.

Keywords： thermoelectric infrared sensor     CMOS-MEMS     thermopile     micromachining     wafer-level package    

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Fabrication of Si-based three-dimensional microbatteries: A review

Chuang YUE, Jing LI, Liwei LIN

Frontiers of Mechanical Engineering 2017, Volume 12, Issue 4,   Pages 459-476 doi: 10.1007/s11465-017-0462-x

Abstract:

High-performance, Si-based three-dimensional (3D) microbattery systems for powering micro/nano-electromechanical systems and lab-on-chip smart electronic devices have attracted increasing research attention. These systems are characterized by compatible fabrication and integratibility resulting from the silicon-based technologies used in their production. The use of support substrates, electrodes or current collectors, electrolytes, and even batteries used in 3D layouts has become increasingly important in fabricating microbatteries with high energy, high power density, and wide-ranging applications. In this review, Si-based 3D microbatteries and related fabrication technologies, especially the production of micro-lithium ion batteries, are reviewed and discussed in detail in order to provide guidance for the design and fabrication.

Keywords： three-dimensional (3D)     wafer-scale     Si-based anode     micro-LIBs     thin-film deposition    

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Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding

Frontiers of Structural and Civil Engineering 2021, Volume 15, Issue 4,   Pages 895-904 doi: 10.1007/s11709-021-0759-z

Abstract: The EP bonding layer can nearly double the drawing strength of the pavement interface from 1.3 MPa, and

Keywords： steel bridge deck pavement     ultra-high-performance concrete     epoxy resin     composite structure     bending fatigue performance    

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Title Author Date Type Operation

Patterned wafer bonding using ultraviolet adhesive

Rui ZHUO, Guanglan LIAO, Wenliang LIU, Lei NIE, Tielin SHI

Journal Article

Special issue: Technologies for future high-efficiency industrial silicon wafer solar cells

Journal Article

Morphologies of diblock copolymer confined in a slit with patterned surfaces studied by dissipative particle

FENG Jian, HUANG Yongmin, LIU Honglai, HU Ying

Journal Article

The electrostatic-alloy bonding technique used in MEMS

WANG Wei, CHEN Wei-ping

Journal Article

Ultraviolet exposure enhanced silicon direct bonding

Guanglan LIAO, Xuekun ZHANG, Xiaohui LIN, Canghai MA, Lei NIE, Tielin SHI,

Journal Article

A space solar cell bonding robot

FU Zhuang, ZHAO Yan-zheng, LIU Ren-qiang, DONG Zhi

Journal Article

Damage mode and failure mechanism of starch based API gluelam bonding

Shi Junyou,Xu Wenbiao and Wang Shumin

Journal Article

Towards Cr(VI)-free anodization of aluminum alloys for aerospace adhesive bonding applications: A review

Shoshan T. Abrahami, John M. M. de Kok, Herman Terryn, Johannes M. C. Mol

Journal Article

ARC welding method for bonding steel with aluminum

Zhenyang LU, Pengfei HUANG, Wenning GAO, Yan LI, Hanpeng ZHANG, Shuyan YIN

Journal Article

Packaging of Micro Electro Mechanical Systems Based on Bulk Silicon Bonding and Film Sealed Technology

Wang Weiyuan,Wang Yuelin

Journal Article

Hyperbranched magnetic polymer: highly efficient removal of Cr(VI) and application in electroplating wastewater

Journal Article

Effects of taping on grinding quality of silicon wafers in backgrinding

Zhigang DONG, Qian ZHANG, Haijun LIU, Renke KANG, Shang GAO

Journal Article

MEMS-based thermoelectric infrared sensors: A review

Dehui XU, Yuelin WANG, Bin XIONG, Tie LI

Journal Article

Fabrication of Si-based three-dimensional microbatteries: A review

Chuang YUE, Jing LI, Liwei LIN

Journal Article

Performance of steel bridge deck pavement structure with ultra high performance concrete based on resin bonding

Journal Article